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Semiconductor Advanced Packaging Engineer - Irvine, California
Irvine, CA · to $150,000OPEN JOB: Principal Application Engineer - Semiconductor Advanced Package
LOCATION: Irvine, California
***Relocation Assistance Available
SALARY: $120,000 to $150,000
INDUSTRY: Manufacturing & Production
JOB CATEGORY: Engineering - Industrial / Manufacturing
This position is with our Adhesive Technologies business unit – where we empower our people to transform industries and provide our customers with a competitive advantage through adhesives, sealants and functional coatings.
What you´ll do
What makes you a good fit
If you are interested in pursuing this opportunity, please respond back and include the following:
JASON DENMARK
Recruiting Manager
INTERMEDIA GROUP, INC.
EMAIL: jdenmark@intermediagroup.com
LINKEDIN: https://www.linkedin.com/in/jasondenmark
LOCATION: Irvine, California
***Relocation Assistance Available
SALARY: $120,000 to $150,000
INDUSTRY: Manufacturing & Production
JOB CATEGORY: Engineering - Industrial / Manufacturing
This position is with our Adhesive Technologies business unit – where we empower our people to transform industries and provide our customers with a competitive advantage through adhesives, sealants and functional coatings.
What you´ll do
- Technical service engineer who provides technical engineering support for the company's Advanced Packaging Material products and responsible for developing in depth application knowledge for the company's Electronics markets.
- Primary responsibilities are technical leading on developmental and commercialized products by optimization of material application processes, and direct interaction with customers to troubleshoot and solve product and process related problems.
- She/he ensures that new and existing products can be successfully employed by the customers in a manner that brings clear and identifiable value.
- Solves technology-specific fundamental problems associated with entire product lines and/or product classes by novel approaches to application process development, troubleshooting, and material characterization.
What makes you a good fit
- Minimum of a bachelor’s degree in Material Science/Engineering, Mechanical Engineering, Chemical Engineering, or other related fields, with 10+ years of experience working in a chemical for semiconductor advanced packaging environment.
- ***Good understanding for the latest Semiconductor Packaging trend. Especially 2.5D and 3D package
- Expertise in wafer level encapsulation and molding process in semiconductor package
- Have strong verbal communication skills one-on-one with colleagues/customers as well as in front of groups with solid interpersonal skills, with ability to work as a team member and independently on multi-task assignments
- Strong ownership and responsibility with customer-oriented mindset and good understanding of customer request & culture
- Effective in using project and time management skills to drive projects to completion and focus on commitment to deliver the highest level of quality work consistently
- Traveling of up to 10% will be part of this role.
If you are interested in pursuing this opportunity, please respond back and include the following:
- Full MS WORD Resume
- Required compensation
- Contact information
- Availability
JASON DENMARK
Recruiting Manager
INTERMEDIA GROUP, INC.
EMAIL: jdenmark@intermediagroup.com
LINKEDIN: https://www.linkedin.com/in/jasondenmark